ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 1 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter package outline schematic features ? high reliability ? high total radiated power ? good spectral matching to si photo detector ? rohs compliance applications ? i nfrared sensor ? l i ght barrier description the firc5730w09 - b20 is a ga al as infrared led housed in a miniature smd package . the device has a peak wavelength of 73 0nm led . cathode anode
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 2 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter absolute maximum rating at 25 0 c symbol parameters ratings units notes i f continuous forward current 150 ma i fp peak forward current 1.0 a 1 v r reverse voltage 5 v t opr operating temperature - 40 ~ +85 0 c t stg storage temperature - 40 ~ +100 0 c t sol soldering temperature 260 0 c 2 p d power dissipation at(or below) 25 free air temperature 510 mw elec tro - optical characteristics t a = 25c (unless otherwise specified) optical characteristics symbol parameters test conditions min typ max units notes ie radiant intensity i f =20ma - 5.0 - mw/sr i f =10 0ma - 25.3 - i f = 15 0 ma - 37.6 - po total radiated power i f =20ma - 15.7 - mw i f =10 0ma - 80 - i f = 15 0ma - 118 - p peak wavelength i f =20ma 720 730 750 nm ? spectral bandwidth i f =20ma - 25 - nm 1/2 angle of half intensity i f =20ma - ? 60 - deg electrical characteristics symbol parameters test conditions min typ max units notes v f forward voltage i f =20 ma 1.7 2.0 2 .4 v i f = 10 0ma 2.2 2.5 3.1 i f =15 0ma 2.3 2.7 3 .4 i r reverse current v r =5v - - 10 a notes: 1 : i fp conditions -- pulse width Q 100s and duty Q 1%. 2 : soldering time Q 5 seconds.
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 3 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter typical characteristic curves
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 4 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter package dimension all dimensions are in mm, unless otherwise stated. recommended soldering mask all dimensio ns are in mm, unless otherwise stated ordering information p art number description quantity firc5730w09 - b20 tape & reel 2000 pcs
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 5 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter reel dimension all dimensions are in mm, unless otherwise stated tape dimension all dimensions are in mm, unles s otherwise stated
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 6 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter reflow profile profile feature pb - free assembly profile temperature min. (tsmin) 150c temperature max. (tsmax) 200c time (ts) from (tsmin to tsmax) 60 - 120 seconds ramp - up rate (t l to t p ) 3c/second max. liquidous temperatu re (t l ) 217c time (t l ) maintained above (t l ) 60 C 150 seconds peak body package temperature 260c +0c / - 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second max time 25c to peak temperature 8 minutes max.
ct microelectronics ct microelectronics rev 0 (preliminary) proprietary & confidential page 7 ju l , 201 3 firc5730w09 - b20 smd type 73 0nm infrared emitter disclaimer ct microelectronics reserves the right to make changes without further notice to any products herein to improve reliabilibility, function or design. ct micro does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. ________________________________________________________ ______________________________ ct microelectronics are not authorized for use as crit ical components in life support devices or systems without express writtten approval of ct microelectronics ltd. 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instruction for use provided in the lab eling, can be reasonably expected to result in significant injury to the use r. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or s ystem, or to affect its safety or effectiveness.
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